High-Density Packaging to Post 32% Growth

High demand for digital consumer and mobile applications such as cellphones, Bluetooth, and digital cameras is driving demand for high-density packages, according to The Information Network, a New Tripoli, PA-based market research company. “High-density packages result in a smaller overall package when compared to packaged components performing the same function,” said Dr. Robert N. Castellano, president of The Information Network, in a statement. “They are ideal for small portable devices such as cellphones, digital audio and Bluetooth-enabled products.” The total high-density packaging (HDP) market is projected to grow 32 percent this year to reach 1.5 billion units, and 21 percent in 2006 to 1.8 billion units. In 2003, HDP was dominated by the communications sector and will continue to do so in 2008. The communications sector held 82.9 percent market share in 2003 followed by the consumer sector with 11 percent share. ADVERTISEMENT The firm expects both the communications and consumer sectors to exhibit strong growth this year to 76.4 percent and 18 percent, respectively. The firm found systems-in-package represented 61.1 percent of the MCM-L market in 2003, growing to 72.9 percent of the market in 2008. “From a purely technical perspective there is indeed a difference between multi-chip module, multi-chip package, and SiP in the incorporation of passive components”, Castellano added. “From a market analysis perspective there really is no differentiation among these three terms due to the commonality of advantages, namely, small size, lower cost of ownership, enhanced electrical performance, and reduced time to market,” he concluded.