| Markets: |
North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe |
| Finishing: |
Enig |
| Type: |
Rigid |
| Number Of Layers: |
6-Layers |
| Dielectric: |
FR-4 |
Product Description
6-Layer with Immersion Gold for memory storage card
1. Base material: Fr4
2. Copper thickness: 1oz
3. Board thickness: 1.2mm
4. Layer: 6-layer
5. Surface fining: ENIG
6. UL, SGS, RoHS, IS09001, CE, IPC
7. High quality&competitive price
8. Quickly delivery&OEM.
|
Our Capability on PCB |
|
Max panel size |
32" * 20" |
|
min line width/space |
3mil/3mil |
|
Copper thickness |
Hoz-3oz |
|
Thickness |
0.2-4.0mm |
|
Layer count |
1-20 |
|
Min hole size |
0.1mm |
|
Surface finishing |
HASL, LF HASL, OSP(Entek), ENIG, Immersion Tin, Immersion Silver, gold finger |
|
Impedance tolerance |
+/-10% |
|
Warp and twist |
≤ 0.5% |
|
Specification |
|
Material |
FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3/CEM-1/Aluminium |
|
Layer No. |
1-18 |
|
Board thickness |
0.015" (0.4mm)-0.125" (3.2mm) |
|
Board Thickness Tolerance |
± 10% |
|
Cooper thickness |
1/2OZ-3OZ |
|
Impedance Control |
± 10% |
|
Warpage |
0.075%-1.5% |
|
Peelable |
0.012" (0.3mm)-0.02" (0.5mm) |
|
Min Trace Width (a) |
0.005" (0.125mm) |
|
Min Space Width (b) |
0.005" (0.125mm) |
|
Min Annular Ring |
0.005" (0.125mm) |
|
SMD Pitch (a) |
0.012" (0.3mm) |
|
BGA Pitch (b) |
0.027" (0.675mm) |
|
Regesiter torlerance |
0.05mm |
|
Min Solder Mask Dam (a) |
0.005" (0.125mm) |
|
Soldermask Clearance (b) |
0.005" (0.125mm) |
|
Min SMT Pad spacing (c) |
0.004" (0.1mm) |
|
Solder Mask Thickness |
0.0007" (0.018mm) |
|
Hole size |
0.01" (0.25mm)-- 0.257" (6.5mm) |
|
Hole Size Tol (+/-) |
± 0.003" (± 0.0762mm) |
|
Aspect Ratio |
6: 1 |
|
Hole Registration |
0.004" (0.1mm) |
|
Plating |
|
HASL |
2.5um |
|
Lead free HASL |
2.5um |
|
Immersion Gold |
Nickel 3-7um Au: 1-3u' ' |
|
OSP |
0.2-0.5um |
|
Outline |
|
Panel Outline Tol (+/-) |
± 0.004' ' (± 0.1mm) |
|
Beveling |
30° 45° |
|
V-cut |
15° 30° 45° 60° |
|
Certificate |
ROHS ISO9001: 2000 TS16949 SGS UL |
Shenzhen Tianweisheng Electronic Co., Ltd. was founded in 1998 and is located in Shenzhen. We have a general investment of RMB 1, 000, 000 and a plant area of more than 50, 000 square meters.
Shenzhen Tianweisheng Electronic Co., Ltd. has abundant financial resources and advanced equipment, including Automatic electroplating production lines, Automatic Horizontal Lines and Lead-Free HAL lines.
As a professional PCB supplier, we have excellent teams which focus on product development & design, quality control & inspection and company management. In order to supply the best products and services, we have built a modern quality management system which is in strict accordance with international standards. Besides, because of large overseas markets, our products have passed UL, ISO9001 and IS014001 certifications. If you have any new idea or concept for the products, please contact us. We are glad to work together with you and finally provide you with satisfactory products.
